LandOfFree - Canadian Patents - Listing for H

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Packaging method and package for edge-coupled optoelectronic...

H - Electricity – 01 – L

Patent

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Packaging microminiature devices

H - Electricity – 01 – L

Patent

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Packaging microminiature devices

H - Electricity – 01 – L

Patent

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Packaging microminiature devices

H - Electricity – 01 – L

Patent

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Packaging multi-chip modules without wire-bond interconnection

H - Electricity – 01 – L

Patent

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Packaging structure for microwave circuit

H - Electricity – 01 – L

Patent

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Packaging structure for one or more ic chips

H - Electricity – 01 – L

Patent

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Pad design for stt-mram

H - Electricity – 01 – L

Patent

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Padded solar cell contacts

H - Electricity – 01 – L

Patent

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Paired transistor arrangement

H - Electricity – 01 – L

Patent

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Pallet based system for forming thin-film solar cells

H - Electricity – 01 – L

Patent

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Panel-shaped semiconductor module

H - Electricity – 01 – L

Patent

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Panel-shaped semiconductor module

H - Electricity – 01 – L

Patent

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Partial planarization of electrically insulative films by...

H - Electricity – 01 – L

Patent

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Partial planarization of electrically insulative films by...

H - Electricity – 01 – L

Patent

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Partially aligned multi-layered circuitry

H - Electricity – 01 – L

Patent

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Partially depleted soi mosfet with self-aligned body tie

H - Electricity – 01 – L

Patent

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Partially isolated amplifying gate thyristor with...

H - Electricity – 01 – L

Patent

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Passivated and encapsulated semiconductors and method of...

H - Electricity – 01 – L

Patent

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Passivated semiconductor device with peripheral protective...

H - Electricity – 01 – L

Patent

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