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Wacs-type mobile communication with a unified frame format

H - Electricity – 04 – Q
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Wafer aligner

H - Electricity – 01 – L
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Wafer based camera module and method of manufacture

H - Electricity – 04 – N
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Wafer bonding apparatus

H - Electricity – 01 – L
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Wafer bonding techniques to minimize built-in stress of...

H - Electricity – 01 – L
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Wafer breaker

H - Electricity – 01 – L
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Wafer carrier

H - Electricity – 01 – L
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Wafer chunck comprising a curved reference surface

H - Electricity – 01 – L
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Wafer comprising optoelectronic circuits and method of...

H - Electricity – 01 – L
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Wafer fabrication by implanting through protective layer

H - Electricity – 01 – L
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Wafer flip apparatus

H - Electricity – 01 – L
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Wafer handling system

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Wafer handling system

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Wafer heating chuck with dual zone backplane heating and...

H - Electricity – 01 – L
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Wafer holder for semiconductor manufacturing apparatus

H - Electricity – 01 – L
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Wafer holder for semiconductor manufacturing apparatus and...

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Wafer holder for semiconductor manufacturing apparatus,...

H - Electricity – 01 – L
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Wafer holding apparatus for holding a wafer

H - Electricity – 01 – L
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Wafer integrated rigid support ring

H - Electricity – 01 – L
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Wafer interlocking transport system

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